简体中文
焊接制程的建议温度曲线
表面黏着元件的回流焊接温度曲线
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Profile Feature |
Sn-Pb Eutectic Assembly |
Pb-Free Assembly |
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Average ramp-up rate( Tsmax to Tp ) |
3 ℃ / sec Max. |
3 ℃ / sec Max. |
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Peak Temperature ( Tp ) |
255 ℃ -0/+5 ℃ |
255 ℃ -0/+5 ℃ |
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Time within 5℃ of actual Peak |
10 ~ 30 sec |
20 ~ 40 sec |
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Ramp - down Rate |
6 ℃ / sec Max. |
6 ℃ / sec Max. |
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Time 25 ℃ to Peak Temperature |
6 minutes Max. |
6 minutes Max. |
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注1：所有温度是指在封装体的表面进行测量的温度。
注2：在峰值温度(tp)正负5度的条件下，定义的回流焊最大"作业"时间
插件式元件的波峰焊接温度曲线
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Profile Feature
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Sn-Pb Eutectic Assembly
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Pb-Free Assembly
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Average ramp-up rate
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~ 200 ℃ / sec
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~ 200 ℃ / sec
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Heating rate during preheat
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Typ. 1 ~ 2, Max 4℃ / sec
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Typ. 1 ~ 2, Max 4℃ / sec
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Final preheat temperature
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Within 125℃ of solder temp.
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Within 125℃ of solder temp.
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Peak Temperature
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235℃
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260℃
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Time within +0 / -5 ℃ of actual peak
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10 sec
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10 sec
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